Low Temperature Co-fired Ceramic (LTCC) is a core technology for the 

integration of packaging and circuit substrates in a new generation of 

high-performance ceramics. Utilizing ceramic as the base material and 

incorporating processes such as precision printing, laminated co-firing, 

and micro-nano processing, LTCC enables the embedding of passive 

components and three-dimensional high-density circuit integration. 

It combines advantages such as miniaturization, high reliability, low loss

 at high frequencies, and resistance to extreme environments. LTCC 

serves as a core fundamental process in fields like 5G/6G communication,

 microwave and millimeter-wave, aerospace, automotive electronics, and 

high-end industrial control. Furthermore, it stands as a pivotal solution 

for achieving high-density, miniaturization, and integration of electronic 

devices.

   Relying on our fully independently developed material system and matu

re full-process production line, our company has achieved the 

industrialization of LTCC technology, completed the localization 

substitution of core raw materials such as raw ceramic chips and slurry,

 and can provide integrated services ranging from customized design, 

process development to large-scale production. Our products cover 

multiple scenarios such as civilian communications and military 

electronics, offering both high performance and high cost-effectiveness

      LTCC technology utilizes inorganic ceramic powder as the base 

material, mixed with organic binders to form a slurry, and then processed

 through tape casting to produce ultra-thin green ceramic 

tapes. Layer-to-layer connectivity is achieved through laser/mechanical 

drilling and micro-via grouting, while high-precision screen printing is

 employed to complete the circuit pattern and the fabrication of 

embedded passive components. Based on product requirements,

 multiple layers of green ceramic tapes are stacked and pressed into

 shape, ultimately undergoing co-firing integration at a low temperature

 of 850-900℃ to form three-dimensional, high-density ceramic circuit 

components that do not interfere with each other.

  The finished product can be equipped with surface-mounted ICs, chips, 

and other active devices to achieve passive/active integrated integration,

 significantly reducing the size of the device and enhancing circuit 

integration and stability.